A systematic on-wafer characterization technique for surface-mounted microwave and RF packages

A systematic on-wafer characterization technique for surface-mounted microwave and RF packages

Advances in Electronic Packaging

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Bibliographic Details
Main Authors: Ooi, B.L., Qiu, Y.L., Leong, M.S., Soe, M.M.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Multi-line Calibration
Reciprocity Condition
Online Access:http://scholarbank.nus.edu.sg/handle/10635/69101
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Institution: National University of Singapore
Description
Summary:Advances in Electronic Packaging

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