A systematic on-wafer characterization technique for surface-mounted microwave and RF packages

Advances in Electronic Packaging

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Bibliographic Details
Main Authors: Ooi, B.L., Qiu, Y.L., Leong, M.S., Soe, M.M.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/69101
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-691012015-03-26T18:58:49Z A systematic on-wafer characterization technique for surface-mounted microwave and RF packages Ooi, B.L. Qiu, Y.L. Leong, M.S. Soe, M.M. ELECTRICAL & COMPUTER ENGINEERING Multi-line Calibration Reciprocity Condition Advances in Electronic Packaging 1 45-48 2014-06-19T02:56:50Z 2014-06-19T02:56:50Z 2001 Conference Paper Ooi, B.L.,Qiu, Y.L.,Leong, M.S.,Soe, M.M. (2001). A systematic on-wafer characterization technique for surface-mounted microwave and RF packages. Advances in Electronic Packaging 1 : 45-48. ScholarBank@NUS Repository. 0791835405 http://scholarbank.nus.edu.sg/handle/10635/69101 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
topic Multi-line Calibration
Reciprocity Condition
spellingShingle Multi-line Calibration
Reciprocity Condition
Ooi, B.L.
Qiu, Y.L.
Leong, M.S.
Soe, M.M.
A systematic on-wafer characterization technique for surface-mounted microwave and RF packages
description Advances in Electronic Packaging
author2 ELECTRICAL & COMPUTER ENGINEERING
author_facet ELECTRICAL & COMPUTER ENGINEERING
Ooi, B.L.
Qiu, Y.L.
Leong, M.S.
Soe, M.M.
format Conference or Workshop Item
author Ooi, B.L.
Qiu, Y.L.
Leong, M.S.
Soe, M.M.
author_sort Ooi, B.L.
title A systematic on-wafer characterization technique for surface-mounted microwave and RF packages
title_short A systematic on-wafer characterization technique for surface-mounted microwave and RF packages
title_full A systematic on-wafer characterization technique for surface-mounted microwave and RF packages
title_fullStr A systematic on-wafer characterization technique for surface-mounted microwave and RF packages
title_full_unstemmed A systematic on-wafer characterization technique for surface-mounted microwave and RF packages
title_sort systematic on-wafer characterization technique for surface-mounted microwave and rf packages
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/69101
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