Detection of Wafer warpages during thermal processing in microlithography

• Main Authors: Ho, W.K., Tay, A., Zhou, Y., Yang, K., Hu, N.
• Other Authors: ELECTRICAL & COMPUTER ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: Fault Detection; Microlithography; Temperature Measurement; Wafer Warpage
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/69892
• Institution: National University of Singapore

2004 8th International Conference on Control, Automation, Robotics and Vision (ICARCV)