Warpage Detection during Baking of Semiconductor substrate in Microlithography

Warpage Detection during Baking of Semiconductor substrate in Microlithography

IECON Proceedings (Industrial Electronics Conference)

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Bibliographic Details
Main Authors: Ho, W.K., Tay, A., Lim, K.W., Zhou, Y., Yang, K.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Fault Detection
Microlithography
Temperature Measurement
Wafer Warpage
Online Access:http://scholarbank.nus.edu.sg/handle/10635/72180
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/72180

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