Hybrid of scattering matrix method and integral equation used for co-simulation of power integrity and EMI in electronic package with large number of P/G vias
10.1109/ECTC.2007.373892
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2014
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sg-nus-scholar.10635-705042015-02-03T17:37:21Z Hybrid of scattering matrix method and integral equation used for co-simulation of power integrity and EMI in electronic package with large number of P/G vias Oo, Z.Z. Liu, E.-X. Wei, X. Choon, M.T.Y. Li, E.-P. Zhang, Y. Li, L.-W. ELECTRICAL & COMPUTER ENGINEERING 10.1109/ECTC.2007.373892 Proceedings - Electronic Components and Technology Conference 815-820 PECCA 2014-06-19T03:12:53Z 2014-06-19T03:12:53Z 2007 Conference Paper Oo, Z.Z.,Liu, E.-X.,Wei, X.,Choon, M.T.Y.,Li, E.-P.,Zhang, Y.,Li, L.-W. (2007). Hybrid of scattering matrix method and integral equation used for co-simulation of power integrity and EMI in electronic package with large number of P/G vias. Proceedings - Electronic Components and Technology Conference : 815-820. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ECTC.2007.373892" target="_blank">https://doi.org/10.1109/ECTC.2007.373892</a> 1424409853 05695503 http://scholarbank.nus.edu.sg/handle/10635/70504 NOT_IN_WOS Scopus |
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10.1109/ECTC.2007.373892 |
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ELECTRICAL & COMPUTER ENGINEERING |
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ELECTRICAL & COMPUTER ENGINEERING Oo, Z.Z. Liu, E.-X. Wei, X. Choon, M.T.Y. Li, E.-P. Zhang, Y. Li, L.-W. |
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Conference or Workshop Item |
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Oo, Z.Z. Liu, E.-X. Wei, X. Choon, M.T.Y. Li, E.-P. Zhang, Y. Li, L.-W. |
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Oo, Z.Z. Liu, E.-X. Wei, X. Choon, M.T.Y. Li, E.-P. Zhang, Y. Li, L.-W. Hybrid of scattering matrix method and integral equation used for co-simulation of power integrity and EMI in electronic package with large number of P/G vias |
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Oo, Z.Z. |
title |
Hybrid of scattering matrix method and integral equation used for co-simulation of power integrity and EMI in electronic package with large number of P/G vias |
title_short |
Hybrid of scattering matrix method and integral equation used for co-simulation of power integrity and EMI in electronic package with large number of P/G vias |
title_full |
Hybrid of scattering matrix method and integral equation used for co-simulation of power integrity and EMI in electronic package with large number of P/G vias |
title_fullStr |
Hybrid of scattering matrix method and integral equation used for co-simulation of power integrity and EMI in electronic package with large number of P/G vias |
title_full_unstemmed |
Hybrid of scattering matrix method and integral equation used for co-simulation of power integrity and EMI in electronic package with large number of P/G vias |
title_sort |
hybrid of scattering matrix method and integral equation used for co-simulation of power integrity and emi in electronic package with large number of p/g vias |
publishDate |
2014 |
url |
http://scholarbank.nus.edu.sg/handle/10635/70504 |
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1681087211841257472 |