Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias

Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias

10.1109/EPTC.2007.4469749

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Bibliographic Details
Main Authors: Zaw, Z.O., Liu, E., Wei, X.C., Li, E., Chua, E.K., Li, L.-W.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/71175
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/71175

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