Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias

Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias

10.1109/EPTC.2007.4469749

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Bibliographic Details
Main Authors: Zaw, Z.O., Liu, E., Wei, X.C., Li, E., Chua, E.K., Li, L.-W.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/71175
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Institution: National University of Singapore
id sg-nus-scholar.10635-71175
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spelling sg-nus-scholar.10635-711752024-11-09T03:19:58Z Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias Zaw, Z.O. Liu, E. Wei, X.C. Li, E. Chua, E.K. Li, L.-W. ELECTRICAL & COMPUTER ENGINEERING 10.1109/EPTC.2007.4469749 Proceedings of the Electronic Packaging Technology Conference, EPTC 421-424 2014-06-19T03:20:45Z 2014-06-19T03:20:45Z 2007 Conference Paper Zaw, Z.O., Liu, E., Wei, X.C., Li, E., Chua, E.K., Li, L.-W. (2007). Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias. Proceedings of the Electronic Packaging Technology Conference, EPTC : 421-424. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2007.4469749 1424413249 http://scholarbank.nus.edu.sg/handle/10635/71175 000253874600077 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description 10.1109/EPTC.2007.4469749
author2 ELECTRICAL & COMPUTER ENGINEERING
author_facet ELECTRICAL & COMPUTER ENGINEERING
Zaw, Z.O.
Liu, E.
Wei, X.C.
Li, E.
Chua, E.K.
Li, L.-W.
format Conference or Workshop Item
author Zaw, Z.O.
Liu, E.
Wei, X.C.
Li, E.
Chua, E.K.
Li, L.-W.
spellingShingle Zaw, Z.O.
Liu, E.
Wei, X.C.
Li, E.
Chua, E.K.
Li, L.-W.
Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias
author_sort Zaw, Z.O.
title Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias
title_short Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias
title_full Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias
title_fullStr Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias
title_full_unstemmed Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias
title_sort novel co-simulation method for analysis of power integrity and emi in electronic packages with large number of power/ground vias
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/71175
_version_ 1821233795917938688

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