Novel co-simulation method for analysis of power integrity and EMI in electronic packages with large number of power/ground vias
10.1109/EPTC.2007.4469749
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Main Authors: | Zaw, Z.O., Liu, E., Wei, X.C., Li, E., Chua, E.K., Li, L.-W. |
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Other Authors: | ELECTRICAL & COMPUTER ENGINEERING |
Format: | Conference or Workshop Item |
Published: |
2014
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Online Access: | http://scholarbank.nus.edu.sg/handle/10635/71175 |
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Institution: | National University of Singapore |
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