Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity
The existing work on via allocation in 3D ICs ignores power/ground vias’ ability to simultaneously reduce voltage bounce and remove heat. This paper develops the first in-depth study on the allocation of power/ground vias in 3D ICs with simultaneous consideration of power and thermal...
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| Main Authors: | , , |
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| Other Authors: | |
| Format: | Article |
| Language: | English |
| Published: |
2012
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| Subjects: | |
| Online Access: | https://hdl.handle.net/10356/94215 http://hdl.handle.net/10220/8745 |
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| Institution: | Nanyang Technological University |
| Language: | English |