Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity

The existing work on via allocation in 3D ICs ignores power/ground vias’ ability to simultaneously reduce voltage bounce and remove heat. This paper develops the first in-depth study on the allocation of power/ground vias in 3D ICs with simultaneous consideration of power and thermal...

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Bibliographic Details
Main Authors: Yu, Hao, Ho, Joanna, He, Lei
Other Authors: School of Electrical and Electronic Engineering
Format: Article
Language:English
Published: 2012
Subjects:
Online Access:https://hdl.handle.net/10356/94215
http://hdl.handle.net/10220/8745
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Institution: Nanyang Technological University
Language: English