Acoustic microscopy reveals IC packaging hidden defects

Proceedings of the Electronic Technology Conference, EPTC

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Bibliographic Details
Main Authors: Ong, S.H., Tan, S.H., Tan, K.T.
Other Authors: ELECTRICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/72454
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-724542015-01-25T20:57:05Z Acoustic microscopy reveals IC packaging hidden defects Ong, S.H. Tan, S.H. Tan, K.T. ELECTRICAL ENGINEERING Proceedings of the Electronic Technology Conference, EPTC 297-303 00313 2014-06-19T05:08:14Z 2014-06-19T05:08:14Z 1997 Conference Paper Ong, S.H.,Tan, S.H.,Tan, K.T. (1997). Acoustic microscopy reveals IC packaging hidden defects. Proceedings of the Electronic Technology Conference, EPTC : 297-303. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/72454 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Proceedings of the Electronic Technology Conference, EPTC
author2 ELECTRICAL ENGINEERING
author_facet ELECTRICAL ENGINEERING
Ong, S.H.
Tan, S.H.
Tan, K.T.
format Conference or Workshop Item
author Ong, S.H.
Tan, S.H.
Tan, K.T.
spellingShingle Ong, S.H.
Tan, S.H.
Tan, K.T.
Acoustic microscopy reveals IC packaging hidden defects
author_sort Ong, S.H.
title Acoustic microscopy reveals IC packaging hidden defects
title_short Acoustic microscopy reveals IC packaging hidden defects
title_full Acoustic microscopy reveals IC packaging hidden defects
title_fullStr Acoustic microscopy reveals IC packaging hidden defects
title_full_unstemmed Acoustic microscopy reveals IC packaging hidden defects
title_sort acoustic microscopy reveals ic packaging hidden defects
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/72454
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