Effect of some geometric and packaging process parameters on die metallization failure

Proceedings of the International Symposium on the Physical 7 Failure Analysis of Integrated Circuits, IPFA

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Main Authors:	Tay, A.A.O., Ong, S.H., Lim, Y.K.
Other Authors:	ELECTRICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/72596
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-72596
record_format	dspace
spelling	sg-nus-scholar.10635-725962015-03-27T17:47:04Z Effect of some geometric and packaging process parameters on die metallization failure Tay, A.A.O. Ong, S.H. Lim, Y.K. ELECTRICAL ENGINEERING MECHANICAL & PRODUCTION ENGINEERING Proceedings of the International Symposium on the Physical 7 Failure Analysis of Integrated Circuits, IPFA 21-26 00234 2014-06-19T05:09:50Z 2014-06-19T05:09:50Z 1995 Conference Paper Tay, A.A.O.,Ong, S.H.,Lim, Y.K. (1995). Effect of some geometric and packaging process parameters on die metallization failure. Proceedings of the International Symposium on the Physical 7 Failure Analysis of Integrated Circuits, IPFA : 21-26. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/72596 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
description	Proceedings of the International Symposium on the Physical 7 Failure Analysis of Integrated Circuits, IPFA
author2	ELECTRICAL ENGINEERING
author_facet	ELECTRICAL ENGINEERING Tay, A.A.O. Ong, S.H. Lim, Y.K.
format	Conference or Workshop Item
author	Tay, A.A.O. Ong, S.H. Lim, Y.K.
spellingShingle	Tay, A.A.O. Ong, S.H. Lim, Y.K. Effect of some geometric and packaging process parameters on die metallization failure
author_sort	Tay, A.A.O.
title	Effect of some geometric and packaging process parameters on die metallization failure
title_short	Effect of some geometric and packaging process parameters on die metallization failure
title_full	Effect of some geometric and packaging process parameters on die metallization failure
title_fullStr	Effect of some geometric and packaging process parameters on die metallization failure
title_full_unstemmed	Effect of some geometric and packaging process parameters on die metallization failure
title_sort	effect of some geometric and packaging process parameters on die metallization failure
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/72596
_version_	1681087594471882752

Effect of some geometric and packaging process parameters on die metallization failure

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