A slim sector model for the analysis of fatigue life of fine pitch flip chip packages
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
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2014
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sg-nus-scholar.10635-730972015-01-12T05:12:37Z A slim sector model for the analysis of fatigue life of fine pitch flip chip packages Zhao, B. Tay, A.A.O. MECHANICAL ENGINEERING Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 PART B 1529-1534 2014-06-19T05:31:07Z 2014-06-19T05:31:07Z 2005 Conference Paper Zhao, B.,Tay, A.A.O. (2005). A slim sector model for the analysis of fatigue life of fine pitch flip chip packages. Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 PART B : 1529-1534. ScholarBank@NUS Repository. 0791842002 http://scholarbank.nus.edu.sg/handle/10635/73097 NOT_IN_WOS Scopus |
| institution |
National University of Singapore |
| building |
NUS Library |
| country |
Singapore |
| collection |
ScholarBank@NUS |
| description |
Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Zhao, B. Tay, A.A.O. |
| format |
Conference or Workshop Item |
| author |
Zhao, B. Tay, A.A.O. |
| spellingShingle |
Zhao, B. Tay, A.A.O. A slim sector model for the analysis of fatigue life of fine pitch flip chip packages |
| author_sort |
Zhao, B. |
| title |
A slim sector model for the analysis of fatigue life of fine pitch flip chip packages |
| title_short |
A slim sector model for the analysis of fatigue life of fine pitch flip chip packages |
| title_full |
A slim sector model for the analysis of fatigue life of fine pitch flip chip packages |
| title_fullStr |
A slim sector model for the analysis of fatigue life of fine pitch flip chip packages |
| title_full_unstemmed |
A slim sector model for the analysis of fatigue life of fine pitch flip chip packages |
| title_sort |
slim sector model for the analysis of fatigue life of fine pitch flip chip packages |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/73097 |
| _version_ |
1681087685526028288 |