Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method

Electronic speckle pattern interferometry of residual stress measurement using hole-indentation method

10.1117/12.621936

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Bibliographic Details
Main Authors: Sim, C.N., Tay, C.J., Cheng, L.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
ESPI
Hole indentation
Out-of-plane displacement
Residual stress measurement
Online Access:http://scholarbank.nus.edu.sg/handle/10635/73416
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Institution: National University of Singapore

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