Laser dicing of silicon wafer

Surface Review and Letters

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Bibliographic Details
Main Authors:	Tang, Y., Fuh, J.Y.H., Loh, H.T., Wong, Y.S., Lim, Y.K.
Other Authors:	MECHANICAL ENGINEERING
Format:	Conference or Workshop Item
Published:	2014
Subjects:	laser dicing Laser materials processing semiconductor silicon wafer
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/73570
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Institution:	National University of Singapore

id	sg-nus-scholar.10635-73570
record_format	dspace
spelling	sg-nus-scholar.10635-735702015-02-14T06:26:47Z Laser dicing of silicon wafer Tang, Y. Fuh, J.Y.H. Loh, H.T. Wong, Y.S. Lim, Y.K. MECHANICAL ENGINEERING laser dicing Laser materials processing semiconductor silicon wafer Surface Review and Letters 15 1-2 153-159 SRLEF 2014-06-19T05:36:44Z 2014-06-19T05:36:44Z 2008-02 Conference Paper Tang, Y.,Fuh, J.Y.H.,Loh, H.T.,Wong, Y.S.,Lim, Y.K. (2008-02). Laser dicing of silicon wafer. Surface Review and Letters 15 (1-2) : 153-159. ScholarBank@NUS Repository. 0218625X http://scholarbank.nus.edu.sg/handle/10635/73570 NOT_IN_WOS Scopus
institution	National University of Singapore
building	NUS Library
country	Singapore
collection	ScholarBank@NUS
topic	laser dicing Laser materials processing semiconductor silicon wafer
spellingShingle	laser dicing Laser materials processing semiconductor silicon wafer Tang, Y. Fuh, J.Y.H. Loh, H.T. Wong, Y.S. Lim, Y.K. Laser dicing of silicon wafer
description	Surface Review and Letters
author2	MECHANICAL ENGINEERING
author_facet	MECHANICAL ENGINEERING Tang, Y. Fuh, J.Y.H. Loh, H.T. Wong, Y.S. Lim, Y.K.
format	Conference or Workshop Item
author	Tang, Y. Fuh, J.Y.H. Loh, H.T. Wong, Y.S. Lim, Y.K.
author_sort	Tang, Y.
title	Laser dicing of silicon wafer
title_short	Laser dicing of silicon wafer
title_full	Laser dicing of silicon wafer
title_fullStr	Laser dicing of silicon wafer
title_full_unstemmed	Laser dicing of silicon wafer
title_sort	laser dicing of silicon wafer
publishDate	2014
url	http://scholarbank.nus.edu.sg/handle/10635/73570
_version_	1681087772373286912

Laser dicing of silicon wafer

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