Laser dicing of silicon wafer

• Main Authors: Tang, Y., Fuh, J.Y.H., Loh, H.T., Wong, Y.S., Lim, Y.K.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: laser dicing; Laser materials processing; semiconductor; silicon wafer
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73570
• Institution: National University of Singapore

Surface Review and Letters