Numerical simulation of the drop impact response of a portable electronic product

• Main Authors: Lim, C.-T., Teo, Y.M., Shim, V.P.W.
• Other Authors: MECHANICAL ENGINEERING
• Format: Conference or Workshop Item
• Published: 2014
• Subjects: Drop impact; Finite element modeling; Mechanical fragility; Physical robustness; Portable electronic product
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/73700
• Institution: National University of Singapore

10.1109/TCAPT.2002.803652