Analysis of delamination in IC packages using a new variable-order singular boundary element

Analysis of delamination in IC packages using a new variable-order singular boundary element

Proceedings - Electronic Components and Technology Conference

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Main Authors: Tay, A.A.O., Lee, K.H., Lim, K.M.
Other Authors: MECHANICAL & PRODUCTION ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/74958
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Institution: National University of Singapore
id sg-nus-scholar.10635-74958
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spelling sg-nus-scholar.10635-749582015-01-06T07:34:04Z Analysis of delamination in IC packages using a new variable-order singular boundary element Tay, A.A.O. Lee, K.H. Lim, K.M. MECHANICAL & PRODUCTION ENGINEERING Proceedings - Electronic Components and Technology Conference 936-943 PECCA 2014-06-19T09:09:19Z 2014-06-19T09:09:19Z 1998 Conference Paper Tay, A.A.O.,Lee, K.H.,Lim, K.M. (1998). Analysis of delamination in IC packages using a new variable-order singular boundary element. Proceedings - Electronic Components and Technology Conference : 936-943. ScholarBank@NUS Repository. 05695503 http://scholarbank.nus.edu.sg/handle/10635/74958 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Proceedings - Electronic Components and Technology Conference
author2 MECHANICAL & PRODUCTION ENGINEERING
author_facet MECHANICAL & PRODUCTION ENGINEERING
Tay, A.A.O.
Lee, K.H.
Lim, K.M.
format Conference or Workshop Item
author Tay, A.A.O.
Lee, K.H.
Lim, K.M.
spellingShingle Tay, A.A.O.
Lee, K.H.
Lim, K.M.
Analysis of delamination in IC packages using a new variable-order singular boundary element
author_sort Tay, A.A.O.
title Analysis of delamination in IC packages using a new variable-order singular boundary element
title_short Analysis of delamination in IC packages using a new variable-order singular boundary element
title_full Analysis of delamination in IC packages using a new variable-order singular boundary element
title_fullStr Analysis of delamination in IC packages using a new variable-order singular boundary element
title_full_unstemmed Analysis of delamination in IC packages using a new variable-order singular boundary element
title_sort analysis of delamination in ic packages using a new variable-order singular boundary element
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/74958
_version_ 1681088017504141312

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