Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering
Proceedings of the Electronic Technology Conference, EPTC
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sg-nus-scholar.10635-750362024-11-13T13:23:01Z Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering Lin, T.Y. Tay, A.A.O. MECHANICAL & PRODUCTION ENGINEERING Proceedings of the Electronic Technology Conference, EPTC 163-169 00313 2014-06-19T09:10:11Z 2014-06-19T09:10:11Z 1997 Conference Paper Lin, T.Y.,Tay, A.A.O. (1997). Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering. Proceedings of the Electronic Technology Conference, EPTC : 163-169. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/75036 NOT_IN_WOS Scopus |
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Proceedings of the Electronic Technology Conference, EPTC |
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MECHANICAL & PRODUCTION ENGINEERING |
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MECHANICAL & PRODUCTION ENGINEERING Lin, T.Y. Tay, A.A.O. |
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Conference or Workshop Item |
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Lin, T.Y. Tay, A.A.O. |
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Lin, T.Y. Tay, A.A.O. Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering |
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Lin, T.Y. |
title |
Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering |
title_short |
Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering |
title_full |
Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering |
title_fullStr |
Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering |
title_full_unstemmed |
Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering |
title_sort |
mechanics of interfacial delamination under hygrothermal stresses during reflow soldering |
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2014 |
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http://scholarbank.nus.edu.sg/handle/10635/75036 |
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1821207050639638528 |