Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering

Proceedings of the Electronic Technology Conference, EPTC

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Main Authors: Lin, T.Y., Tay, A.A.O.
Other Authors: MECHANICAL & PRODUCTION ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/75036
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-750362024-11-13T13:23:01Z Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering Lin, T.Y. Tay, A.A.O. MECHANICAL & PRODUCTION ENGINEERING Proceedings of the Electronic Technology Conference, EPTC 163-169 00313 2014-06-19T09:10:11Z 2014-06-19T09:10:11Z 1997 Conference Paper Lin, T.Y.,Tay, A.A.O. (1997). Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering. Proceedings of the Electronic Technology Conference, EPTC : 163-169. ScholarBank@NUS Repository. http://scholarbank.nus.edu.sg/handle/10635/75036 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description Proceedings of the Electronic Technology Conference, EPTC
author2 MECHANICAL & PRODUCTION ENGINEERING
author_facet MECHANICAL & PRODUCTION ENGINEERING
Lin, T.Y.
Tay, A.A.O.
format Conference or Workshop Item
author Lin, T.Y.
Tay, A.A.O.
spellingShingle Lin, T.Y.
Tay, A.A.O.
Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering
author_sort Lin, T.Y.
title Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering
title_short Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering
title_full Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering
title_fullStr Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering
title_full_unstemmed Mechanics of interfacial delamination under hygrothermal stresses during reflow soldering
title_sort mechanics of interfacial delamination under hygrothermal stresses during reflow soldering
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/75036
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