Studies of galvanic corrosion (Al-Ti Cell) on microchip Al bondpads and elimination solutions

Studies of galvanic corrosion (Al-Ti Cell) on microchip Al bondpads and elimination solutions

Conference Proceedings from the International Symposium for Testing and Failure Analysis

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Main Authors: Younan, H., Zhiqiang, M., Siping, Z., Hao, G.
Other Authors: MATERIALS SCIENCE AND ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/75251
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-752512015-02-16T18:08:29Z Studies of galvanic corrosion (Al-Ti Cell) on microchip Al bondpads and elimination solutions Younan, H. Zhiqiang, M. Siping, Z. Hao, G. MATERIALS SCIENCE AND ENGINEERING Conference Proceedings from the International Symposium for Testing and Failure Analysis 193-196 2014-06-19T09:34:14Z 2014-06-19T09:34:14Z 2007 Conference Paper Younan, H.,Zhiqiang, M.,Siping, Z.,Hao, G. (2007). Studies of galvanic corrosion (Al-Ti Cell) on microchip Al bondpads and elimination solutions. Conference Proceedings from the International Symposium for Testing and Failure Analysis : 193-196. ScholarBank@NUS Repository. 0871708639 http://scholarbank.nus.edu.sg/handle/10635/75251 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Conference Proceedings from the International Symposium for Testing and Failure Analysis
author2 MATERIALS SCIENCE AND ENGINEERING
author_facet MATERIALS SCIENCE AND ENGINEERING
Younan, H.
Zhiqiang, M.
Siping, Z.
Hao, G.
format Conference or Workshop Item
author Younan, H.
Zhiqiang, M.
Siping, Z.
Hao, G.
spellingShingle Younan, H.
Zhiqiang, M.
Siping, Z.
Hao, G.
Studies of galvanic corrosion (Al-Ti Cell) on microchip Al bondpads and elimination solutions
author_sort Younan, H.
title Studies of galvanic corrosion (Al-Ti Cell) on microchip Al bondpads and elimination solutions
title_short Studies of galvanic corrosion (Al-Ti Cell) on microchip Al bondpads and elimination solutions
title_full Studies of galvanic corrosion (Al-Ti Cell) on microchip Al bondpads and elimination solutions
title_fullStr Studies of galvanic corrosion (Al-Ti Cell) on microchip Al bondpads and elimination solutions
title_full_unstemmed Studies of galvanic corrosion (Al-Ti Cell) on microchip Al bondpads and elimination solutions
title_sort studies of galvanic corrosion (al-ti cell) on microchip al bondpads and elimination solutions
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/75251
_version_ 1681088070577815552

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