Via design optimization for high speed device packaging

Proceedings of the Electronic Packaging Technology Conference, EPTC

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Bibliographic Details
Main Authors:	Low, Hong-Guan, Iyer, Mahadevan K., Ooi, Ban-Leong, Leong, Mook-Seng
Other Authors:	INSTITUTE OF MICROELECTRONICS
Format:	Article
Published:	2014
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/81348
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Institution:	National University of Singapore

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