Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path
10.1116/1.3046155
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2014
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sg-nus-scholar.10635-836092024-11-09T07:59:59Z Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path Lee, C. Xie, J. ELECTRICAL & COMPUTER ENGINEERING 10.1116/1.3046155 Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 27 3 1267-1271 JVTBD 2014-10-07T04:43:08Z 2014-10-07T04:43:08Z 2009 Conference Paper Lee, C., Xie, J. (2009). Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 27 (3) : 1267-1271. ScholarBank@NUS Repository. https://doi.org/10.1116/1.3046155 10711023 http://scholarbank.nus.edu.sg/handle/10635/83609 000266500300048 Scopus |
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National University of Singapore |
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NUS Library |
| continent |
Asia |
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Singapore Singapore |
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NUS Library |
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ScholarBank@NUS |
| description |
10.1116/1.3046155 |
| author2 |
ELECTRICAL & COMPUTER ENGINEERING |
| author_facet |
ELECTRICAL & COMPUTER ENGINEERING Lee, C. Xie, J. |
| format |
Conference or Workshop Item |
| author |
Lee, C. Xie, J. |
| spellingShingle |
Lee, C. Xie, J. Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path |
| author_sort |
Lee, C. |
| title |
Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path |
| title_short |
Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path |
| title_full |
Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path |
| title_fullStr |
Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path |
| title_full_unstemmed |
Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path |
| title_sort |
design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/83609 |
| _version_ |
1821188073812131840 |