Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path
10.1116/1.3046155
Saved in:
Main Authors: | , |
---|---|
Other Authors: | |
Format: | Conference or Workshop Item |
Published: |
2014
|
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/83609 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Be the first to leave a comment!