Design and optimization of wafer bonding packaged microelectromechanical systems thermoelectric power generators with heat dissipation path

10.1116/1.3046155

Saved in:
Bibliographic Details
Main Authors: Lee, C., Xie, J.
Other Authors: ELECTRICAL & COMPUTER ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/83609
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
Be the first to leave a comment!
You must be logged in first