A study of dynamic testing of single solder joints and its application to finite element modelling

A study of dynamic testing of single solder joints and its application to finite element modelling

10.1243/03093247JSA617

Saved in:
Bibliographic Details
Main Authors: Liu, J.F., Shim, V.P.W., Tan, V.B.C.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
dynamic testing
finite element method modelling
single solder joint
split Hopkinson bar
stress waves
Online Access:http://scholarbank.nus.edu.sg/handle/10635/84819
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/84819

Similar Items