A study of dynamic testing of single solder joints and its application to finite element modelling
10.1243/03093247JSA617
Saved in:
Main Authors: | Liu, J.F., Shim, V.P.W., Tan, V.B.C. |
---|---|
Other Authors: | MECHANICAL ENGINEERING |
Format: | Article |
Published: |
2014
|
Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/84819 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Institution: | National University of Singapore |
Similar Items
-
Dynamic tensile properties of magnesium nanocomposite
by: Guo, Y.B., et al.
Published: (2014) -
Dynamic material characterisation of solder interconnects in microelectronic packaging
by: ONG KAI CHUAN
Published: (2011) -
Dynamic Mechanical and Failure Properties of Solder Joints
by: LIU JIANFEI
Published: (2011) -
A technique for rapid two-stage dynamic tensile loading of polymers
by: Shim, V.P.W., et al.
Published: (2014) -
An analysis of stress uniformity in split Hopkinson bar test specimens
by: Yang, L.M., et al.
Published: (2014)