Study of the grain size, particle size and roughness of substrate in relation to the magnetic properties of electroplated permalloy

• Main Authors: Yi, J.B., Li, X.P., Ding, J., Seet, H.L.
• Other Authors: MATERIALS SCIENCE AND ENGINEERING
• Format: Article
• Published: 2014
• Subjects: Composite wire; Electroplating; Grain size; Particle size; Permalloy; Roughness
• Online Access: http://scholarbank.nus.edu.sg/handle/10635/85687
• Institution: National University of Singapore

10.1016/j.jallcom.2006.01.105