Surface roughness measurement of semi-conductor wafers using a modified total integrated scattering model

Surface roughness measurement of semi-conductor wafers using a modified total integrated scattering model

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Bibliographic Details
Main Authors: Tay, C.J., Wang, S.H., Quan, C., Ng, C.K.
Other Authors: MECHANICAL ENGINEERING
Format: Article
Published: 2014
Subjects:
Light scattering
Non-contact measurement
Surface roughness
Total integrated scattering (TIS)
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85710
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/85710

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