Void growth and interaction in a soft material

10.1142/S021797921006423X

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Bibliographic Details
Main Authors: Wong, W.H., Guo, T.F., Cheng, L.
Other Authors: MATERIALS SCIENCE AND ENGINEERING
Format: Article
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85831
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Institution: National University of Singapore
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