Heat transfer from flat and ribbed surfaces with interrupted heating

Heat transfer from flat and ribbed surfaces with interrupted heating

Advances in Electronic Packaging

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Bibliographic Details
Main Authors: Low, K.W., Yap, C.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85983
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Institution: National University of Singapore
Description
Summary:Advances in Electronic Packaging

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