Heat transfer from flat and ribbed surfaces with interrupted heating

Advances in Electronic Packaging

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Bibliographic Details
Main Authors: Low, K.W., Yap, C.
Other Authors: MECHANICAL ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/85983
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Institution: National University of Singapore
id sg-nus-scholar.10635-85983
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spelling sg-nus-scholar.10635-859832015-05-17T06:45:53Z Heat transfer from flat and ribbed surfaces with interrupted heating Low, K.W. Yap, C. MECHANICAL ENGINEERING Advances in Electronic Packaging 2 989-996 2014-10-07T09:14:30Z 2014-10-07T09:14:30Z 2001 Conference Paper Low, K.W.,Yap, C. (2001). Heat transfer from flat and ribbed surfaces with interrupted heating. Advances in Electronic Packaging 2 : 989-996. ScholarBank@NUS Repository. 0791835405 http://scholarbank.nus.edu.sg/handle/10635/85983 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
country Singapore
collection ScholarBank@NUS
description Advances in Electronic Packaging
author2 MECHANICAL ENGINEERING
author_facet MECHANICAL ENGINEERING
Low, K.W.
Yap, C.
format Conference or Workshop Item
author Low, K.W.
Yap, C.
spellingShingle Low, K.W.
Yap, C.
Heat transfer from flat and ribbed surfaces with interrupted heating
author_sort Low, K.W.
title Heat transfer from flat and ribbed surfaces with interrupted heating
title_short Heat transfer from flat and ribbed surfaces with interrupted heating
title_full Heat transfer from flat and ribbed surfaces with interrupted heating
title_fullStr Heat transfer from flat and ribbed surfaces with interrupted heating
title_full_unstemmed Heat transfer from flat and ribbed surfaces with interrupted heating
title_sort heat transfer from flat and ribbed surfaces with interrupted heating
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/85983
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