Modeling of delamination in IC packages
10.1109/ICEPT-HDP.2012.6474744
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2014
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sg-nus-scholar.10635-860272016-03-03T00:54:40Z Modeling of delamination in IC packages Tay, A.A.O. MECHANICAL ENGINEERING 10.1109/ICEPT-HDP.2012.6474744 ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging 854-860 2014-10-07T09:15:02Z 2014-10-07T09:15:02Z 2012 Conference Paper Tay, A.A.O. (2012). Modeling of delamination in IC packages. ICEPT-HDP 2012 Proceedings - 2012 13th International Conference on Electronic Packaging Technology and High Density Packaging : 854-860. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ICEPT-HDP.2012.6474744" target="_blank">https://doi.org/10.1109/ICEPT-HDP.2012.6474744</a> 9781467316804 http://scholarbank.nus.edu.sg/handle/10635/86027 NOT_IN_WOS Scopus |
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National University of Singapore |
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NUS Library |
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Singapore |
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ScholarBank@NUS |
| description |
10.1109/ICEPT-HDP.2012.6474744 |
| author2 |
MECHANICAL ENGINEERING |
| author_facet |
MECHANICAL ENGINEERING Tay, A.A.O. |
| format |
Conference or Workshop Item |
| author |
Tay, A.A.O. |
| spellingShingle |
Tay, A.A.O. Modeling of delamination in IC packages |
| author_sort |
Tay, A.A.O. |
| title |
Modeling of delamination in IC packages |
| title_short |
Modeling of delamination in IC packages |
| title_full |
Modeling of delamination in IC packages |
| title_fullStr |
Modeling of delamination in IC packages |
| title_full_unstemmed |
Modeling of delamination in IC packages |
| title_sort |
modeling of delamination in ic packages |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/86027 |
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1681089908447379456 |