Vapor pressure and voiding effects on thin film damage

Vapor pressure and voiding effects on thin film damage

Thin Solid Films

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Bibliographic Details
Main Authors: Chew, H.B., Guo, T.F., Cheng, L.
Other Authors: MATERIALS SCIENCE AND ENGINEERING
Format: Conference or Workshop Item
Published: 2014
Subjects:
Discrete voids
Thin film
Vapor pressure
Void shape
Online Access:http://scholarbank.nus.edu.sg/handle/10635/86973
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Institution: National University of Singapore
Description
Summary:Thin Solid Films

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