Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit?
10.1021/cm0527571
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sg-nus-scholar.10635-900572024-11-09T03:11:38Z Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit? Chen, C.-H. Chen, B.-H. Hong, L. CHEMICAL & BIOMOLECULAR ENGINEERING 10.1021/cm0527571 Chemistry of Materials 18 13 2959-2968 CMATE 2014-10-09T07:00:53Z 2014-10-09T07:00:53Z 2006-06-27 Article Chen, C.-H., Chen, B.-H., Hong, L. (2006-06-27). Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit?. Chemistry of Materials 18 (13) : 2959-2968. ScholarBank@NUS Repository. https://doi.org/10.1021/cm0527571 08974756 http://scholarbank.nus.edu.sg/handle/10635/90057 000238386000006 Scopus |
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10.1021/cm0527571 |
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CHEMICAL & BIOMOLECULAR ENGINEERING |
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CHEMICAL & BIOMOLECULAR ENGINEERING Chen, C.-H. Chen, B.-H. Hong, L. |
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Chen, C.-H. Chen, B.-H. Hong, L. |
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Chen, C.-H. Chen, B.-H. Hong, L. Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit? |
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Chen, C.-H. |
title |
Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit? |
title_short |
Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit? |
title_full |
Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit? |
title_fullStr |
Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit? |
title_full_unstemmed |
Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit? |
title_sort |
role of cu2+ as an additive in an electroless nickel-phosphorus plating system: a stabilizer or a codeposit? |
publishDate |
2014 |
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http://scholarbank.nus.edu.sg/handle/10635/90057 |
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