Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit?

10.1021/cm0527571

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Main Authors: Chen, C.-H., Chen, B.-H., Hong, L.
Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
Format: Article
Published: 2014
Online Access:http://scholarbank.nus.edu.sg/handle/10635/90057
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spelling sg-nus-scholar.10635-900572024-11-09T03:11:38Z Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit? Chen, C.-H. Chen, B.-H. Hong, L. CHEMICAL & BIOMOLECULAR ENGINEERING 10.1021/cm0527571 Chemistry of Materials 18 13 2959-2968 CMATE 2014-10-09T07:00:53Z 2014-10-09T07:00:53Z 2006-06-27 Article Chen, C.-H., Chen, B.-H., Hong, L. (2006-06-27). Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit?. Chemistry of Materials 18 (13) : 2959-2968. ScholarBank@NUS Repository. https://doi.org/10.1021/cm0527571 08974756 http://scholarbank.nus.edu.sg/handle/10635/90057 000238386000006 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
description 10.1021/cm0527571
author2 CHEMICAL & BIOMOLECULAR ENGINEERING
author_facet CHEMICAL & BIOMOLECULAR ENGINEERING
Chen, C.-H.
Chen, B.-H.
Hong, L.
format Article
author Chen, C.-H.
Chen, B.-H.
Hong, L.
spellingShingle Chen, C.-H.
Chen, B.-H.
Hong, L.
Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit?
author_sort Chen, C.-H.
title Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit?
title_short Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit?
title_full Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit?
title_fullStr Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit?
title_full_unstemmed Role of Cu2+ as an additive in an electroless nickel-phosphorus plating system: A stabilizer or a codeposit?
title_sort role of cu2+ as an additive in an electroless nickel-phosphorus plating system: a stabilizer or a codeposit?
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/90057
_version_ 1821191426042494976