The role of bi 3+-complei Ion as the stabilizer in electroless nickel plating process

The role of bi 3+-complei Ion as the stabilizer in electroless nickel plating process

10.1002/aic.11807

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Bibliographic Details
Main Authors: Wang, K., Hong, L., Liu, Z.-J.L.
Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
Format: Article
Published: 2014
Subjects:
BI 3+ -complex ion
Chemical replacement reaction
Electroless nickel plating
Stabilization mechanism
Stabilizer
Online Access:http://scholarbank.nus.edu.sg/handle/10635/90356
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Institution: National University of Singapore

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http://scholarbank.nus.edu.sg/handle/10635/90356

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