The role of bi 3+-complei Ion as the stabilizer in electroless nickel plating process

The role of bi 3+-complei Ion as the stabilizer in electroless nickel plating process

10.1002/aic.11807

Saved in:
Bibliographic Details
Main Authors: Wang, K., Hong, L., Liu, Z.-J.L.
Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
Format: Article
Published: 2014
Subjects:
BI 3+ -complex ion
Chemical replacement reaction
Electroless nickel plating
Stabilization mechanism
Stabilizer
Online Access:http://scholarbank.nus.edu.sg/handle/10635/90356
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: National University of Singapore
id sg-nus-scholar.10635-90356
record_format dspace
spelling sg-nus-scholar.10635-903562023-10-26T08:41:21Z The role of bi 3+-complei Ion as the stabilizer in electroless nickel plating process Wang, K. Hong, L. Liu, Z.-J.L. CHEMICAL & BIOMOLECULAR ENGINEERING BI 3+ -complex ion Chemical replacement reaction Electroless nickel plating Stabilization mechanism Stabilizer 10.1002/aic.11807 AIChE Journal 55 4 1046-1055 AICEA 2014-10-09T07:04:20Z 2014-10-09T07:04:20Z 2009-04 Article Wang, K., Hong, L., Liu, Z.-J.L. (2009-04). The role of bi 3+-complei Ion as the stabilizer in electroless nickel plating process. AIChE Journal 55 (4) : 1046-1055. ScholarBank@NUS Repository. https://doi.org/10.1002/aic.11807 00011541 http://scholarbank.nus.edu.sg/handle/10635/90356 000264710100017 Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic BI 3+ -complex ion
Chemical replacement reaction
Electroless nickel plating
Stabilization mechanism
Stabilizer
spellingShingle BI 3+ -complex ion
Chemical replacement reaction
Electroless nickel plating
Stabilization mechanism
Stabilizer
Wang, K.
Hong, L.
Liu, Z.-J.L.
The role of bi 3+-complei Ion as the stabilizer in electroless nickel plating process
description 10.1002/aic.11807
author2 CHEMICAL & BIOMOLECULAR ENGINEERING
author_facet CHEMICAL & BIOMOLECULAR ENGINEERING
Wang, K.
Hong, L.
Liu, Z.-J.L.
format Article
author Wang, K.
Hong, L.
Liu, Z.-J.L.
author_sort Wang, K.
title The role of bi 3+-complei Ion as the stabilizer in electroless nickel plating process
title_short The role of bi 3+-complei Ion as the stabilizer in electroless nickel plating process
title_full The role of bi 3+-complei Ion as the stabilizer in electroless nickel plating process
title_fullStr The role of bi 3+-complei Ion as the stabilizer in electroless nickel plating process
title_full_unstemmed The role of bi 3+-complei Ion as the stabilizer in electroless nickel plating process
title_sort role of bi 3+-complei ion as the stabilizer in electroless nickel plating process
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/90356
_version_ 1781785516983713792

Similar Items