The role of bi 3+-complei Ion as the stabilizer in electroless nickel plating process

10.1002/aic.11807

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Bibliographic Details
Main Authors:	Wang, K., Hong, L., Liu, Z.-J.L.
Other Authors:	CHEMICAL & BIOMOLECULAR ENGINEERING
Format:	Article
Published:	2014
Subjects:	BI 3+ -complex ion Chemical replacement reaction Electroless nickel plating Stabilization mechanism Stabilizer
Online Access:	http://scholarbank.nus.edu.sg/handle/10635/90356
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Institution:	National University of Singapore

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