The effect of purge environment on thermal rearrangement of ortho-functional polyamide and polyimide

10.1016/j.polymer.2013.03.001

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Bibliographic Details
Main Authors: Wang, H., Paul, D.R., Chung, T.-S.
Other Authors: CHEMICAL & BIOMOLECULAR ENGINEERING
Format: Article
Published: 2014
Subjects:
Online Access:http://scholarbank.nus.edu.sg/handle/10635/90330
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Institution: National University of Singapore