The effect of purge environment on thermal rearrangement of ortho-functional polyamide and polyimide
10.1016/j.polymer.2013.03.001
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Main Authors: | Wang, H., Paul, D.R., Chung, T.-S. |
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Other Authors: | CHEMICAL & BIOMOLECULAR ENGINEERING |
Format: | Article |
Published: |
2014
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Subjects: | |
Online Access: | http://scholarbank.nus.edu.sg/handle/10635/90330 |
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Institution: | National University of Singapore |
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