Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils

Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils

Journal of Adhesion Science and Technology

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Bibliographic Details
Main Authors: Ang, A.K.S., Kang, E.T., Neoh, K.G., Tan, K.L., Cui, C.Q., Lim, T.B.
Other Authors: INSTITUTE OF MICROELECTRONICS
Format: Article
Published: 2014
Subjects:
Copper
Grafting
Lamination
Polyimides
T-peel strength
XPS
Online Access:http://scholarbank.nus.edu.sg/handle/10635/91544
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Institution: National University of Singapore

Internet

http://scholarbank.nus.edu.sg/handle/10635/91544

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