Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils

Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils

Journal of Adhesion Science and Technology

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Bibliographic Details
Main Authors: Ang, A.K.S., Kang, E.T., Neoh, K.G., Tan, K.L., Cui, C.Q., Lim, T.B.
Other Authors: INSTITUTE OF MICROELECTRONICS
Format: Article
Published: 2014
Subjects:
Copper
Grafting
Lamination
Polyimides
T-peel strength
XPS
Online Access:http://scholarbank.nus.edu.sg/handle/10635/91544
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Institution: National University of Singapore
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spelling sg-nus-scholar.10635-915442024-11-14T00:34:06Z Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils Ang, A.K.S. Kang, E.T. Neoh, K.G. Tan, K.L. Cui, C.Q. Lim, T.B. INSTITUTE OF MICROELECTRONICS CHEMICAL ENGINEERING PHYSICS Copper Grafting Lamination Polyimides T-peel strength XPS Journal of Adhesion Science and Technology 12 8 889-900 JATEE 2014-10-09T08:19:21Z 2014-10-09T08:19:21Z 1998 Article Ang, A.K.S.,Kang, E.T.,Neoh, K.G.,Tan, K.L.,Cui, C.Q.,Lim, T.B. (1998). Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils. Journal of Adhesion Science and Technology 12 (8) : 889-900. ScholarBank@NUS Repository. 01694243 http://scholarbank.nus.edu.sg/handle/10635/91544 NOT_IN_WOS Scopus
institution National University of Singapore
building NUS Library
continent Asia
country Singapore
Singapore
content_provider NUS Library
collection ScholarBank@NUS
topic Copper
Grafting
Lamination
Polyimides
T-peel strength
XPS
spellingShingle Copper
Grafting
Lamination
Polyimides
T-peel strength
XPS
Ang, A.K.S.
Kang, E.T.
Neoh, K.G.
Tan, K.L.
Cui, C.Q.
Lim, T.B.
Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils
description Journal of Adhesion Science and Technology
author2 INSTITUTE OF MICROELECTRONICS
author_facet INSTITUTE OF MICROELECTRONICS
Ang, A.K.S.
Kang, E.T.
Neoh, K.G.
Tan, K.L.
Cui, C.Q.
Lim, T.B.
format Article
author Ang, A.K.S.
Kang, E.T.
Neoh, K.G.
Tan, K.L.
Cui, C.Q.
Lim, T.B.
author_sort Ang, A.K.S.
title Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils
title_short Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils
title_full Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils
title_fullStr Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils
title_full_unstemmed Low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils
title_sort low-temperature thermal graft copolymerization of 1-vinyl imidazole on polyimide films with simultaneous lamination to copper foils
publishDate 2014
url http://scholarbank.nus.edu.sg/handle/10635/91544
_version_ 1821206928968122368

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