Electroless Plating of Copper and Nickel via a Sn-Free Process on Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole
10.1149/1.1387237
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2014
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sg-nus-scholar.10635-919602024-11-11T19:30:07Z Electroless Plating of Copper and Nickel via a Sn-Free Process on Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole Zhang, Y. Tan, K.L. Yang, G.H. Kang, E.T. Neoh, K.G. CHEMICAL & ENVIRONMENTAL ENGINEERING PHYSICS 10.1149/1.1387237 Journal of the Electrochemical Society 148 9 C574-C582 JESOA 2014-10-09T09:53:11Z 2014-10-09T09:53:11Z 2001-09 Article Zhang, Y., Tan, K.L., Yang, G.H., Kang, E.T., Neoh, K.G. (2001-09). Electroless Plating of Copper and Nickel via a Sn-Free Process on Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole. Journal of the Electrochemical Society 148 (9) : C574-C582. ScholarBank@NUS Repository. https://doi.org/10.1149/1.1387237 00134651 http://scholarbank.nus.edu.sg/handle/10635/91960 000170813000021 Scopus |
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National University of Singapore |
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NUS Library |
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Asia |
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Singapore Singapore |
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| description |
10.1149/1.1387237 |
| author2 |
CHEMICAL & ENVIRONMENTAL ENGINEERING |
| author_facet |
CHEMICAL & ENVIRONMENTAL ENGINEERING Zhang, Y. Tan, K.L. Yang, G.H. Kang, E.T. Neoh, K.G. |
| format |
Article |
| author |
Zhang, Y. Tan, K.L. Yang, G.H. Kang, E.T. Neoh, K.G. |
| spellingShingle |
Zhang, Y. Tan, K.L. Yang, G.H. Kang, E.T. Neoh, K.G. Electroless Plating of Copper and Nickel via a Sn-Free Process on Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole |
| author_sort |
Zhang, Y. |
| title |
Electroless Plating of Copper and Nickel via a Sn-Free Process on Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole |
| title_short |
Electroless Plating of Copper and Nickel via a Sn-Free Process on Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole |
| title_full |
Electroless Plating of Copper and Nickel via a Sn-Free Process on Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole |
| title_fullStr |
Electroless Plating of Copper and Nickel via a Sn-Free Process on Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole |
| title_full_unstemmed |
Electroless Plating of Copper and Nickel via a Sn-Free Process on Polyimide Films Modified by Surface Graft Copolymerization with 1-Vinylimidazole |
| title_sort |
electroless plating of copper and nickel via a sn-free process on polyimide films modified by surface graft copolymerization with 1-vinylimidazole |
| publishDate |
2014 |
| url |
http://scholarbank.nus.edu.sg/handle/10635/91960 |
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1821231744002555904 |