Numerical Analysis of Microring Resonator obtained by Wafer-Bonding Technology

• المؤلفون الرئيسيون: Kusko, M, Alexandropoulos, D, TEE, Chyng Wen, Kapsalis, A, Cristea, D, Syvridis, D
• التنسيق: text
• اللغة: English
• منشور في: Institutional Knowledge at Singapore Management University 2005
• الموضوعات: Etching; Fabrication; Microrings; Optical communications; Resonators; Wafer bonding; Waveguides; Physical Sciences and Mathematics
• الوصول للمادة أونلاين: https://ink.library.smu.edu.sg/lkcsb_research/3331; https://proceedings.spiedigitallibrary.org/article.aspx?articleid=875139
• المؤسسة: Singapore Management University

Microring resonators will be one of the most important components of the next generation of optical communications. In this work, we have analyzed from theoretical perspective a new proposed microring resonator structure based on the wafer-bonding technique which implies the vertical coupling betwee...