Fabrication-tolerant active-passive integration scheme for vertically-coupled microring resonators

The large-scale photonic integration of microring resonators in three dimensions made possible by recent developments in vertical coupling and wafer bonding technology is shown to be sensitive to lateral mask misalignment for the ring and bus waveguides introduced during the fabrication process. For...

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Bibliographic Details
Main Authors: TEE, Chyng Wen, Williams, KA, Penty, RV, White, IH
Format: text
Language:English
Published: Institutional Knowledge at Singapore Management University 2006
Subjects:
Online Access:https://ink.library.smu.edu.sg/lkcsb_research/3337
https://ink.library.smu.edu.sg/context/lkcsb_research/article/4336/viewcontent/Fabrication_tolerant_active_passive_integration_scheme_for_vertically_coupled_microring_resonators.pdf
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Institution: Singapore Management University
Language: English