Fabrication-tolerant active-passive integration scheme for vertically-coupled microring resonators
The large-scale photonic integration of microring resonators in three dimensions made possible by recent developments in vertical coupling and wafer bonding technology is shown to be sensitive to lateral mask misalignment for the ring and bus waveguides introduced during the fabrication process. For...
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Main Authors: | , , , |
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Format: | text |
Language: | English |
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Institutional Knowledge at Singapore Management University
2006
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Online Access: | https://ink.library.smu.edu.sg/lkcsb_research/3337 https://ink.library.smu.edu.sg/context/lkcsb_research/article/4336/viewcontent/Fabrication_tolerant_active_passive_integration_scheme_for_vertically_coupled_microring_resonators.pdf |
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Institution: | Singapore Management University |
Language: | English |