Fabrication-tolerant active-passive integration scheme for vertically-coupled microring resonators

The large-scale photonic integration of microring resonators in three dimensions made possible by recent developments in vertical coupling and wafer bonding technology is shown to be sensitive to lateral mask misalignment for the ring and bus waveguides introduced during the fabrication process. For...

Full description

Saved in:
Bibliographic Details
Main Authors: TEE, Chyng Wen, Williams, KA, Penty, RV, White, IH
Format: text
Language:English
Published: Institutional Knowledge at Singapore Management University 2006
Subjects:
Online Access:https://ink.library.smu.edu.sg/lkcsb_research/3337
https://ink.library.smu.edu.sg/context/lkcsb_research/article/4336/viewcontent/Fabrication_tolerant_active_passive_integration_scheme_for_vertically_coupled_microring_resonators.pdf
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Singapore Management University
Language: English
id sg-smu-ink.lkcsb_research-4336
record_format dspace
spelling sg-smu-ink.lkcsb_research-43362019-04-01T08:53:22Z Fabrication-tolerant active-passive integration scheme for vertically-coupled microring resonators TEE, Chyng Wen Williams, KA Penty, RV White, IH The large-scale photonic integration of microring resonators in three dimensions made possible by recent developments in vertical coupling and wafer bonding technology is shown to be sensitive to lateral mask misalignment for the ring and bus waveguides introduced during the fabrication process. For a typical 20-μm radius, vertically coupled microring calculations reveal a linear relationship between deviation in the coupling coefficient and lateral misalignment. A coupling coefficient reduction of 50% is predicted for a lateral misalignment of 0.3 μm, which is typical for an alignment accuracy limited by the current state-of-the-art mask alignment process. The use of a wide multimode bus waveguide is proposed to ameliorate this alignment sensitivity. The mode-expanded bus waveguide, together with its physically wider structure, reduces the dependence of modal overlap and coupling length on precise alignment, resulting in significantly relaxed fabrication tolerance. Deviation of coupling coefficient decreases by an order of magnitude for the new ring coupler geometry, where a sole reduction of 5% is obtained for the same amount of misalignment. The implications of the proposed structure are subsequently investigated for microring laser performance. The differential slope efficiency is shown to be at least five times less sensitive to lateral misalignment for the proposed structure within a small misalignment regime. This readily adaptable coupler geometry based on existing vertical coupling architectures is transferable to any fabrication scheme with multiple waveguide layers coupled vertically, and is of particular importance to microring resonators with small radii. 2006-01-01T08:00:00Z text application/pdf https://ink.library.smu.edu.sg/lkcsb_research/3337 info:doi/10.1109/JSTQE.2005.862947 https://ink.library.smu.edu.sg/context/lkcsb_research/article/4336/viewcontent/Fabrication_tolerant_active_passive_integration_scheme_for_vertically_coupled_microring_resonators.pdf http://creativecommons.org/licenses/by-nc-nd/4.0/ Research Collection Lee Kong Chian School Of Business eng Institutional Knowledge at Singapore Management University Electromagnetic propagation fiber coupling large-scale integration multimode waveguides optical coupling optical diffraction optical fiber coupling optical planar wave-guides optical resonators semiconductor device fabrication semiconductor device modeling semiconductor microring waveguide couplers Business
institution Singapore Management University
building SMU Libraries
continent Asia
country Singapore
Singapore
content_provider SMU Libraries
collection InK@SMU
language English
topic Electromagnetic propagation
fiber coupling
large-scale integration
multimode waveguides
optical coupling
optical diffraction
optical fiber coupling
optical planar wave-guides
optical resonators
semiconductor device fabrication
semiconductor device modeling
semiconductor microring
waveguide couplers
Business
spellingShingle Electromagnetic propagation
fiber coupling
large-scale integration
multimode waveguides
optical coupling
optical diffraction
optical fiber coupling
optical planar wave-guides
optical resonators
semiconductor device fabrication
semiconductor device modeling
semiconductor microring
waveguide couplers
Business
TEE, Chyng Wen
Williams, KA
Penty, RV
White, IH
Fabrication-tolerant active-passive integration scheme for vertically-coupled microring resonators
description The large-scale photonic integration of microring resonators in three dimensions made possible by recent developments in vertical coupling and wafer bonding technology is shown to be sensitive to lateral mask misalignment for the ring and bus waveguides introduced during the fabrication process. For a typical 20-μm radius, vertically coupled microring calculations reveal a linear relationship between deviation in the coupling coefficient and lateral misalignment. A coupling coefficient reduction of 50% is predicted for a lateral misalignment of 0.3 μm, which is typical for an alignment accuracy limited by the current state-of-the-art mask alignment process. The use of a wide multimode bus waveguide is proposed to ameliorate this alignment sensitivity. The mode-expanded bus waveguide, together with its physically wider structure, reduces the dependence of modal overlap and coupling length on precise alignment, resulting in significantly relaxed fabrication tolerance. Deviation of coupling coefficient decreases by an order of magnitude for the new ring coupler geometry, where a sole reduction of 5% is obtained for the same amount of misalignment. The implications of the proposed structure are subsequently investigated for microring laser performance. The differential slope efficiency is shown to be at least five times less sensitive to lateral misalignment for the proposed structure within a small misalignment regime. This readily adaptable coupler geometry based on existing vertical coupling architectures is transferable to any fabrication scheme with multiple waveguide layers coupled vertically, and is of particular importance to microring resonators with small radii.
format text
author TEE, Chyng Wen
Williams, KA
Penty, RV
White, IH
author_facet TEE, Chyng Wen
Williams, KA
Penty, RV
White, IH
author_sort TEE, Chyng Wen
title Fabrication-tolerant active-passive integration scheme for vertically-coupled microring resonators
title_short Fabrication-tolerant active-passive integration scheme for vertically-coupled microring resonators
title_full Fabrication-tolerant active-passive integration scheme for vertically-coupled microring resonators
title_fullStr Fabrication-tolerant active-passive integration scheme for vertically-coupled microring resonators
title_full_unstemmed Fabrication-tolerant active-passive integration scheme for vertically-coupled microring resonators
title_sort fabrication-tolerant active-passive integration scheme for vertically-coupled microring resonators
publisher Institutional Knowledge at Singapore Management University
publishDate 2006
url https://ink.library.smu.edu.sg/lkcsb_research/3337
https://ink.library.smu.edu.sg/context/lkcsb_research/article/4336/viewcontent/Fabrication_tolerant_active_passive_integration_scheme_for_vertically_coupled_microring_resonators.pdf
_version_ 1770571401380495360