Deposition of au, au-v and au-vox on si wafers by co-sputtering technique

• المؤلفون الرئيسيون: S. Narksitipan, T. Bannuru, W. L. Brown, R. P. Vinci, S. Thongtem
• التنسيق: دورية
• منشور في: 2018
• الموضوعات: Engineering; Materials Science; Physics and Astronomy
• الوصول للمادة أونلاين: https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=68149152180&origin=inward; http://cmuir.cmu.ac.th/jspui/handle/6653943832/49079
• المؤسسة: Chiang Mai University

Au, Au-V and Au-VOx thin films were deposited on Si wafers by a co-sputtering technique. A fourpoint probe shows that the electrical resistivity of pure Au thin film on Si wafer without annealing is 7.2 m ·cm. The resistivities of thin films deposited on Si wafers, with or without annealing, tended...