Stress analysis of thin adhesive bonding dissimilar adherends single lap joints

In recent years, adhesives have been widely used to bond dissimilar material members particularly in aircraft and automobile structures. If the adhesive layer is very small compared with adherends, a more refined mesh model is needed for FEA modeling. That will take a lot of CPU-time to compute solu...

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Bibliographic Details
Main Authors: Thongchai Fongsamootr, Charoenyut Dechwayukul
Format: Conference Proceeding
Published: 2018
Subjects:
Online Access:https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84869787309&origin=inward
http://cmuir.cmu.ac.th/jspui/handle/6653943832/62172
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Institution: Chiang Mai University

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