Stress analysis of thin adhesive bonding dissimilar adherends single lap joints
In recent years, adhesives have been widely used to bond dissimilar material members particularly in aircraft and automobile structures. If the adhesive layer is very small compared with adherends, a more refined mesh model is needed for FEA modeling. That will take a lot of CPU-time to compute solu...
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| 格式: | Conference Proceeding |
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2018
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| 在線閱讀: | https://www.scopus.com/inward/record.uri?partnerID=HzOxMe3b&scp=84869787309&origin=inward http://cmuir.cmu.ac.th/jspui/handle/6653943832/62172 |
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| 機構: | Chiang Mai University |
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