Development of thermal conductivity of metal-filled epoxy adhesives for microelectronic industry

Thesis (M.Eng.)--Chulalongkorn University, 1995

Saved in:
Bibliographic Details
Main Author: Benjang Monkollertsirisuk
Other Authors: Ura Pancharoen
Format: Theses and Dissertations
Language:English
Published: Chulalongkorn University 2013
Online Access:http://cuir.car.chula.ac.th/handle/123456789/32924
Tags: Add Tag
No Tags, Be the first to tag this record!
Institution: Chulalongkorn University
Language: English