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1
Process optimization approach in fine pitch Cu wire bonding
by Wong B.K., Yong C.C., Eu P.L., Yap B.K.
Published 2023
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2
Improvement of Cu-Al bond integrity on low k pad structures
by Kid W.B., Leng E.P., Yong C.C., Yi O.X., Kar Y.B.
Published 2023
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Conference paper
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3
Metallurgical bond integrity of C45 ultra fine pitch with 18m copper wire
Other Authors: “...36992192300...”
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