Improvement of Cu-Al bond integrity on low k pad structures

Gold wires are commonly used for wire-bonding and it fits well the industrial requirements. However, the price of Gold wires increasing significantly, Copper wires is a potential replacement for Gold due to their superior electrical and mechanical properties. In order to incorporate Cu in the wire-b...

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Bibliographic Details
Main Authors: Kid W.B., Leng E.P., Yong C.C., Yi O.X., Kar Y.B.
Other Authors: 36992192300
Format: Conference paper
Published: 2023
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Institution: Universiti Tenaga Nasional